4 Layer High TG Impedance Control Fine Pitch PCB

 Number of layers: 4

Surface finish: ENIG

Base material: High TG FR4

Outer Layer W/S: 4/3.5mil

Inner layer W/S: 4/3.5mil

Thickness: 1.0mm

Min. hole diameter: 0.25mm

Special process: Impedance Control

 

Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB

Own lamination process to convenient production for Multilayer PCB and shorten the lead time.

Jiangxi facility is environmental-friendly approved by the government .

Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin.

Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.

Engineers with more than 15 years of experience

The management level is highly educated, 30% have professional titles and more than ten years of work experience.

High staff stability, low mobility.

UL/ISO9001/SGS/IATF16949/ROHS/ISO1400 certificated.

Sales office in Shenzhen and own 12,000sqm factory in Jiangxi.

Establish an e-commerce system to reduce transaction costs and increase market response speed.

 

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