Communication Equipment PCB
In order to shorten the signal transmission distance and reduce the signal transmission loss, the 5G communication PCB, gradually move towards high-density wiring, fine wire spacing, the development of small aperture, thin profile and high reliability. Process Difficulty Of High Frequency And High Speed PCB Board Alignment Accuracy Accuracy is tightened, and tolerance convergence between layers is required. The board size becomes more demanding for this convergence requirement Size Gets Bigger Machinability deteriorates, maneuverability deteriorates, and blind holes need to be buried 1. Cost increase 2. Difficulty in alignment accuracy Impedance Accuracy The etching challenge is great: 1. The etching factor: the smaller the better, the etching accuracy tolerance is 10mil and the line width is controlled by +/-1MIL, and the line width tolerance above 10mil is controlled by +/-10%. 2. Higher requirements for line width, line spacing and line thickness. 3. Others: wiring density, si...